Hoʻopuka i ka ʻōnaehana ʻōnaehana o nā mea optoelectronic

Hoʻopuka i ka ʻōnaehana ʻōnaehana o nā mea optoelectronic

ʻO ka ʻōnaehana ʻōnaehana optoelectronicMea hana optoelectronicʻO ka ʻōnaewele ʻōnaehana kahi kaʻina hoʻohui ʻōnaehana e hoʻopili i nā mea optoelectronic, nā ʻāpana uila a me nā mea noi hana. Hoʻohana nui ʻia ka ʻeke optoelectronic i kakamaʻilio ʻike makaʻōnaehana, kikowaena ʻikepili, laser ʻoihana, hōʻike optical civil a me nā ʻano ʻē aʻe. Hiki ke hoʻokaʻawale ʻia i loko o nā pae o ka hoʻopili: chip IC level packaging, device packaging, module packaging, system board level packaging, subsystem assembly and system integration.

He ʻokoʻa nā mea optoelectronic mai nā ʻenehana semiconductor maʻamau, ma waho aʻe o ka loaʻa ʻana o nā ʻāpana uila, aia nā mīkini collimation optical, no laila ʻoi aku ka paʻakikī o ka hoʻonohonoho ʻana o ka hāmeʻa, a ua haku ʻia i kekahi mau ʻāpana like ʻole. Loaʻa i nā ʻāpana ʻelua ʻelua mau hale, hoʻokahi ʻo ka laser diode,mea nānā kiʻia hoʻokomo ʻia nā ʻāpana ʻē aʻe i loko o kahi pūʻolo pani. E like me kāna noi hiki ke hoʻokaʻawale ʻia i loko o ka pāʻoihana maʻamau a me nā koi o ka mea kūʻai aku o ka pūʻulu proprietary. Hiki ke hoʻokaʻawale ʻia ka pūʻolo maʻamau pāʻoihana i loko o ka pūʻolo TO coaxial a me ka pūʻolo butterfly.

1.TO pūʻolo Coaxial pūʻolo e pili ana i nā ʻāpana optical (laser chip, backlight detector) i loko o ka paipu, ʻo ka lens a me ke ala ʻike o ka fiber pili waho ma ka axis kumu like. Hoʻokomo ʻia ka puʻupuʻu laser a me ka mea ʻike backlight i loko o ka hāmeʻa coaxial package ma ka thermic nitride a pili i ke kaapuni waho ma o ke alakaʻi uea gula. No ka mea, hoʻokahi wale nō lens i loko o ka pūʻolo coaxial, ua hoʻomaikaʻi ʻia ka maikaʻi o ka hui ʻana i ka hoʻohālikelike ʻia me ka pūʻolo butterfly. ʻO ka mea i hoʻohana ʻia no ka pūpū TO tube he kila kila a i ʻole Corvar alloy. Hoʻokumu ʻia ka hale holoʻokoʻa i ke kumu, ka lens, ka poloka hoʻoluʻu waho a me nā ʻāpana ʻē aʻe, a ʻo ke ʻano he coaxial. ʻO ka maʻamau, TO puʻe i ka laser i loko o ka laser chip (LD), backlight detector chip (PD), L-bracket, etc. Inā loaʻa kahi ʻōnaehana hoʻomalu wela kūloko e like me TEC, pono pū ka thermistor kūloko a me ka chip control.

2. Pūʻolo Butterfly No ka mea ua like ke ʻano me ka pepeke, ua kapa ʻia kēia ʻano pūʻolo butterfly package, e like me ka mea i hōʻike ʻia ma ke Kiʻi 1, ke ʻano o ka mea ʻike maka. ʻo kahi laʻana,lele SOA（mea hoʻonui ʻike maka semiconductor butterfly. Loaʻa iā ia kekahi mau hiʻohiʻona, e like me kahi ākea nui i loko o ka pūʻolo butterfly, maʻalahi e kau i ka thermoelectric cooler semiconductor, a ʻike i ka hana hoʻomalu wela e pili ana; ʻO ka chip laser pili, lens a me nā mea ʻē aʻe e maʻalahi ke hoʻonohonoho ʻia i ke kino; Hoʻokaʻawale ʻia nā wāwae paipu ma nā ʻaoʻao ʻelua, maʻalahi ke ʻike i ka pilina o ke kaapuni; He kūpono ke ʻano no ka hoʻāʻo ʻana a me ka hoʻopili ʻana. ʻO ka puʻupuʻu maʻamau he cuboid, ʻoi aku ka paʻakikī o ka hana a me ka hoʻokō, hiki ke kūkulu ʻia i loko o ka refrigeration, wela wela, ceramic base block, chip, thermistor, backlight monitoring, a hiki ke kākoʻo i nā alakaʻi paʻa o nā mea āpau i luna. He wahi pūpū nui, hoʻopau wela maikaʻi.