Evolution a me ka holomua o CPO optoelectronic co-packaging technology Mahele ʻelua

ʻO ka ulu a me ka holomua o CPOoptoelectronicʻenehana hui pū

Optoelectronic co-packaging ʻaʻole ia he ʻenehana hou, hiki ke ʻike ʻia ka hoʻomohala ʻana i ka makahiki 1960, akā i kēia manawa, ʻo ka photoelectric co-packaging he ʻāpana maʻalahi wale nō ia.nā mea hana optoelectronichui pu. Ma ka 1990s, me ka piʻi ʻana o kamodule kamaʻilio opticalʻoihana, ua hoʻomaka ka photoelectric copackaging e puka mai. Me ka blowout o ka mana computing kiʻekiʻe a me ka kiʻekiʻe bandwidth koi i keia makahiki, photoelectric co-packaging, a me kona 'ike loea lala pili, ua loaa hou i ka nui noonoo.
I ka hoʻomohala ʻana i ka ʻenehana, loaʻa i kēlā me kēia pae nā ʻano like ʻole, mai 2.5D CPO e pili ana i 20/50Tb/s koi, i 2.5D Chiplet CPO e pili ana i 50/100Tb/s koi, a ʻike hope i ka 3D CPO e pili ana i 100Tb/s uku.

Hoʻopili ka 2.5D CPO i kaʻōpona ʻōpikaa me ka pūnaewele hoʻololi chip ma luna o ka ia substrate e hoʻopōkole i ka laina mamao a hoʻonui i ka I / O density, a me ka 3D CPO pili pono i ka optical IC i ka intermediary papa e hoʻokō i ka interconnection o ka I / O pitch o ka emi o 50um. ʻO ka pahuhopu o kona hoʻololi ʻana he mea maopopo loa, ʻo ia ka hoʻemi ʻana i ka mamao ma waena o ka module hoʻololi photoelectric a me ka chip hoʻololi pūnaewele e like me ka hiki.
I kēia manawa, aia nō ka CPO i kona wā kamaliʻi, a aia nō nā pilikia e like me ka haʻahaʻa haʻahaʻa a me nā kumukūʻai mālama kiʻekiʻe, a he kakaikahi nā mea hana ma ka mākeke hiki ke hāʻawi piha i nā huahana pili CPO. ʻO Broadcom wale nō, Marvell, Intel, a me kahi liʻiliʻi o nā mea pāʻani ʻē aʻe i loaʻa nā hoʻonā waiwai piha ma ka mākeke.
Ua hoʻokomo ʻo Marvell i kahi hoʻololi ʻenehana 2.5D CPO me ka hoʻohana ʻana i ke kaʻina VIA-LAST i ka makahiki i hala. Ma hope o ka hana ʻia ʻana o ka chip optical chip, ua hana ʻia ka TSV me ka hiki ke hoʻololi ʻia o OSAT, a laila hoʻohui ʻia ka chip flip-chip uila i ka chip optical chip. Hoʻopili ʻia nā modules optical 16 a me ka chip Marvell Teralynx7 ma ka PCB e hana i kahi hoʻololi, hiki ke hoʻokō i ka helu hoʻololi o 12.8Tbps.

Ma ka OFC o kēia makahiki, hōʻike pū ʻo Broadcom lāua ʻo Marvell i ka hanauna hou loa o 51.2Tbps switch chips me ka hoʻohana ʻana i ka ʻenehana co-packaging optoelectronic.
Mai ka hanauna hou loa o Broadcom o CPO kikoʻī kikoʻī, CPO 3D pūʻolo ma o ka hoʻomaikaʻi ʻana i ke kaʻina hana e hoʻokō i kahi kiʻekiʻe I/O density, CPO mana hoʻohana i ka 5.5W/800G, ʻoi aku ka maikaʻi o ka hoʻokō ʻana i ka ikehu. Ma ka manawa like, ke haki nei ʻo Broadcom i kahi nalu hoʻokahi o 200Gbps a me 102.4T CPO.
Ua hoʻonui ʻo Cisco i kāna hoʻopukapuka ʻana i ka ʻenehana CPO, a ua hana i kahi hōʻike huahana CPO i ka OFC o kēia makahiki, e hōʻike ana i kāna ʻenehana CPO hōʻiliʻili a me ka noi ʻana ma kahi multiplexer / demultiplexer i hoʻohui ʻia. Ua ʻōlelo ʻo Cisco e alakaʻi ia i kahi hoʻolālā hoʻokele o CPO ma nā hoʻololi 51.2Tb, a ukali ʻia e ka hoʻokomo nui ʻana i nā pōʻai hoʻololi 102.4Tb.
Ua hoʻolauna lōʻihi ʻo Intel i nā hoʻololi CPO, a i kēia mau makahiki i hala iho nei, ua hoʻomau ʻo Intel i ka hana pū me Ayar Labs e ʻimi i nā hāmeʻa interconnection hōʻailona hōʻailona kiʻekiʻe aʻe, e wehe ana i ke ala no ka hana nui o nā optoelectronic co-packaging a me nā mea pili optical.
ʻOiai ʻo nā modules pluggable ka mea i koho mua ʻia, ʻo ka hoʻomaikaʻi ʻana i ka ikehu holoʻokoʻa e hiki ai iā CPO ke lawe mai i mea e hoʻonui ai i nā mea hana. Wahi a LightCounting, e hoʻomaka ana nā moku CPO e hoʻonui nui ʻia mai nā awa 800G a me 1.6T, e hoʻomaka mālie e kūʻai ʻia mai 2024 a 2025, a hana i kahi leo nui mai 2026 a 2027. Ma ka manawa like, manaʻo ʻo CIR Loaʻa ka loaʻa kālā o ka mākeke photoelectric i ka $ 5.4 biliona ma 2027.

Ma mua o kēia makahiki, ua hoʻolaha ʻo TSMC e hui pū me Broadcom, Nvidia a me nā mea kūʻai aku nui ʻē aʻe e hoʻomohala pū i ka ʻenehana photonics silika, nā ʻāpana optical maʻamau CPO a me nā huahana hou, ka ʻenehana kaʻina hana mai 45nm a 7nm, a ʻōlelo ʻo ia ka wikiwiki o ka hapa lua. o ka makahiki aʻe i hoʻomaka ai e hālāwai me ke kauoha nui, 2025 a i ʻole e hiki i ka pae leo.
Ma ke ʻano he kahua ʻenehana interdisciplinary e pili ana i nā mea photonic, nā kaapuni i hoʻohui ʻia, ka hoʻopili ʻana, ka hoʻohālikelike ʻana a me ka simulation, ʻike ʻia ka ʻenehana CPO i nā loli i lawe ʻia e ka optoelectronic fusion, a ʻo nā loli i lawe ʻia i ka lawe ʻana i ka ʻikepili me ke kānalua ʻole. ʻOiai hiki ke ʻike ʻia ka noi ʻana o CPO ma nā kikowaena ʻikepili nui no ka manawa lōʻihi, me ka hoʻonui hou ʻana o ka mana computing nui a me nā koi bandwidth kiʻekiʻe, ua lilo ʻo CPO photoelectric co-seal technology i kahua kaua hou.
Hiki ke ʻike ʻia e manaʻoʻiʻo nā mea hana e hana ana ma CPO ʻo 2025 ka node kī, ʻo ia hoʻi kahi node me ka uku hoʻololi o 102.4Tbps, a e hoʻonui ʻia nā hemahema o nā modula pluggable. ʻOiai hiki ke hele mālie nā noi CPO, ʻo ka opto-electronic co-packaging ʻo ia wale nō ke ala e loaʻa ai ka wikiwiki kiʻekiʻe, ka bandwidth kiʻekiʻe a me nā pūnaewele mana haʻahaʻa.